WAFER PACKAGING METHOD

摘要

A wafer packaging method includes the following steps. A light transmissive carrier is provided. A hydrolytic temporary bonding layer is formed on the light transmissive carrier. A first surface of a light transmissive protection sheet is bonded to the hydrolytic temporary bonding layer, such that the hydrolytic temporary bonding layer is located between the light transmissive protection sheet and the light transmissive carrier. A second surface of the light transmissive protection sheet facing away from the first surface is bonded to a third surface of a wafer. The light transmissive carrier, the hydrolytic temporary bonding layer, the light transmissive protection sheet, and the wafer are immersed in a high temperature liquid, such that adhesion force of the hydrolytic temporary bonding layer is eliminated. The light transmissive protection sheet and the wafer are obtained from the high temperature liquid.

主权项

1. A wafer packaging method comprising:
(a) providing a light transmissive carrier; (b) forming a hydrolytic temporary bonding layer on the light transmissive carrier; (c) bonding a first surface of a light transmissive protection sheet to the hydrolytic temporary bonding layer, such that the hydrolytic temporary bonding layer is located between the light transmissive protection sheet and the light transmissive carrier; (d) bonding a second surface of the light transmissive protection sheet facing away from the first surface to a third surface of a wafer, wherein the third surface of the wafer has a plurality of integrated circuit units; (e) immersing the light transmissive carrier, the hydrolytic temporary bonding layer, the light transmissive protection sheet, and the wafer in a high temperature liquid, such that adhesion force of the hydrolytic temporary bonding layer is eliminated; and (f) obtaining the light transmissive protection sheet and the wafer from the high temperature liquid.