| 发明名称 |
Packaging Methods and Packaged Semiconductor Devices |
| 摘要 |
Packaging methods and packaged semiconductor devices are disclosed. In some embodiments, a method of packaging semiconductor devices includes forming first contact pads on a carrier, forming a wiring structure over the first contact pads, and forming second contact pads over the wiring structure. A first packaged semiconductor device is coupled to a first set of the second contact pads, and a second packaged semiconductor device is coupled to a second set of the second contact pads. The carrier is removed. The second packaged semiconductor device comprises a different package type than the first packaged semiconductor device. |
| 申请公布号 |
US2014210081(A1) |
申请公布日期 |
2014.07.31 |
| 申请号 |
US201313753328 |
申请日期 |
2013.01.29 |
| 申请人 |
Ltd. Taiwan Semiconductor Manufacturing Company, |
发明人 |
Lin Jing-Cheng;Hung Jui-Pin |
| 分类号 |
H01L23/498;H01L23/00 |
主分类号 |
H01L23/498 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of packaging semiconductor devices, the method comprising:
forming a plurality of first contact pads on a carrier; forming a wiring structure over the plurality of first contact pads; forming a plurality of second contact pads over the wiring structure; coupling a first packaged semiconductor device to a first set of the plurality of second contact pads; coupling a second packaged semiconductor device to a second set of the plurality of second contact pads, the second packaged semiconductor device comprising a different package type than the first packaged semiconductor device; and removing the carrier. |
| 地址 |
US |
