发明名称 Camera module comprising an imaging sensor and recognition sensor within a view angle of a lens
摘要 A camera module is disclosed which can be capable of selective use in different modes by disposing an imaging sensor and a recognition sensor within a view angle of a lens. The camera module includes: a sensor die including a silicon substrate 10 and a sensor implemented on the silicon substrate; and a lens barrel hermetically holding the sensor die and including at least one lens. The silicon substrate 10 includes an imaging sensor 12 and a recognition sensor 14, such as an ambient light sensor, proximity sensor or gesture recognition sensor, implemented adjacent to each other so as to be included within a view angle 20 of the lens. The imaging sensor 12 may be larger than the recognition sensor 14 and they may be arranged such that the recognition sensor 14 is disposed at a long side of the imaging sensor 12. The imaging sensor 12 may be one of: a 16:9 sensor having 1280x720 pixels of a high definition (HD) level with a pixel size of 175 microns or less; and a 16:9 sensor having 1920x1080 pixels of a full HD level. The lens may have an F-number of 2.0 or less.
申请公布号 GB2510227(A) 申请公布日期 2014.07.30
申请号 GB20130020376 申请日期 2013.11.19
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD 发明人 HYUN KIM
分类号 H04N5/225;H01L27/14;H04M1/02 主分类号 H04N5/225
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