Process kit components for titanium sputtering chamber

摘要

A process kit for a sputtering chamber comprises a deposition ring, cover ring, and a shield assembly, for placement about a substrate support in a sputtering chamber. The deposition ring comprising an annular band with an inner lip extending transversely, a raised ridge substantially parallel to the substrate support, an inner open channel, and a ledge radially outward of the raised ridge. A cover ring at least partially covers the deposition ring, the cover ring comprising an annular plate comprising a footing which rests on a surface about the substrate support, and downwardly extending first and second cylindrical walls.

主权项

1. A deposition ring for placement about a substrate support in a sputtering chamber, the substrate support comprising a substrate receiving surface having a plane and a peripheral wall that terminates before an overhanging edge of a substrate received on the substrate receiving surface, the deposition ring comprising:
(a) an annular band surrounding the peripheral wall of the support, the annular band being composed of a material and having an exposed surface that is a roughened surface of the material,. the annular band comprising:
(i) an inner lip extending transversely from the annular band, the inner lip being substantially parallel to the peripheral wall of the support and terminating below the overhanging edge of the substrate;(ii) a raised ridge that is substantially parallel to the plane of the receiving surface of the substrate support;(iii) an inner open channel between the inner lip and the raised ridge, the inner open channel extending at least partially below the overhanging edge of the substrate; and(iv) a ledge radially outward of the raised ridge.