| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for individually measuring a contact angle &thetas; of an underfill resin with a surface of various members constituting a gap between a wiring board and a semiconductor element (IC chip) connected by a flip-chip process to the wiring board, by constituting an observable pseudo model of a condition in which the underfill resin impregnates the gap, and to provide an observation apparatus for the method.SOLUTION: The method for measuring a contact angle of an underfill resin comprises: immersing a test piece B having the same surface condition as that of a surface with which an underfill resin is in contact in a gap, vertically into a melted underfill resin solution A at a predetermined velocity v; and obtaining a contact angle between the underfill resin and the test piece during immersion. The predetermined velocity v simulates the velocity of the melted underfill resin impregnating a gap between a wiring board and a semiconductor element connected by a flip-chip process to the board. |
