发明名称 PLATING PRETREATMENT LIQUID REMOVING BODY AND REMOVAL METHOD
摘要 <p>PROBLEM TO BE SOLVED: To provide a plating pretreatment liquid removing body capable of dewatering properly pretreatment liquid applied onto a metal wire, and to provide a removal method.SOLUTION: A plating pretreatment liquid removing body for sandwiching a metal wire 25 to which pretreatment liquid 12 is applied from the upper and lower sides and removing excessive pretreatment liquid includes: a pedestal 16 formed of dried felt, for receiving the metal wire 25 to which the pretreatment liquid 12 is applied; a presser material 18 formed of felt, and provided over the pedestal 16; a plate 20 provided on the upper surface of the presser material 18; and a thumbscrew 21 for pressing the presser material 18 onto the pedestal 16 through the plate 20 to adjust the pressure.</p>
申请公布号 JP2014136834(A) 申请公布日期 2014.07.28
申请号 JP20130007617 申请日期 2013.01.18
申请人 HITACHI CABLE FINE TECH LTD 发明人 NAKADE YOSHIKI
分类号 C23C2/02;C23C2/38 主分类号 C23C2/02
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