发明名称 METHOD FOR MANUFACTURING WIRING BOARD
摘要 <p>PROBLEM TO BE SOLVED: To provide a method for manufacturing a wiring board including a metal wiring with excellent conduction properties, high pattern definition properties, and adhesion.SOLUTION: A method for manufacturing a wiring board including a base material and a metal wiring comprises the steps of: (1) making a surface 100a of the base material water repellent using a fluorine atom-containing gas; (2) forming a groove 120 on the surface 100a of the base material made water repellent by etching the surface 100a using a near-infrared laser; and (3) forming a metal wiring 140 in the groove by imparting an ink including a metal element-containing substance into the groove.</p>
申请公布号 JP2014138160(A) 申请公布日期 2014.07.28
申请号 JP20130007409 申请日期 2013.01.18
申请人 FUJIFILM CORP 发明人 SASAKI HIROTOMO
分类号 H05K3/10;H05K3/00;H05K3/18 主分类号 H05K3/10
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