| 摘要 |
A light emitting device package according to an embodiment of the present invention includes a package body; an electrode which is installed at the package body; a light emitting device which is arranged in the package body and is connected to the electrode; and a molding member which molds the light emitting device; and a conductive oxidation inhibition layer which is formed between the electrode and the molding member and includes a carbon containing material. |
