| 摘要 |
A process for depositing a thin film material on a substrate is disclosed, comprising simultaneously directing a series of gas flows from the output face of a delivery head of a thin film deposition system toward the surface of a substrate, and wherein the series of gas flows comprises at least a first reactive gaseous material, an inert purge gas, and a second reactive gaseous material, wherein the first reactive gaseous material is capable of reacting with a substrate surface treated with the second reactive gaseous material, wherein one or more of the gas flows provides a pressure that at least contributes to the separation of the surface of the substrate from the face of the delivery head. A system capable of carrying out such a process is also disclosed. |
| 主权项 |
1. A process for thin film deposition of a solid material onto a substrate comprising:
(A) transporting a substrate into an entrance section; (B) transporting the substrate from the entrance section to a coating section; (C) transporting the substrate through the coating section comprising:
(i) a plurality of sources for, respectively, a plurality of gaseous materials comprising at least a first, a second, and a third source for a first, a second, and a third gaseous material, respectively;(ii) a delivery head for delivering the gaseous materials to a substrate receiving thin film deposition and comprising:
(a) a plurality of inlet ports comprising at least a first, a second, and a third inlet port for receiving the first, the second, and the third gaseous material, respectively; and(b) a depositing output face separated a distance from the substrate and comprising a plurality of substantially parallel elongated output openings for each of the first, the second, and the third gaseous material, wherein the said delivery head is designed to deliver the first, the second, and the third gaseous materials simultaneously from the output openings in the depositing output face, wherein a substantially uniform distance is maintained between the depositing output face of the delivery head and a surface of the substrate during thin film deposition, wherein the flows of one or more of the gaseous materials from the delivery head to the substrate surface for thin film deposition provide at least part of the force separating the output face of the delivery head from the surface of the substrate; and (D) transporting the substrate from the coating section at least partially into an exit section;
wherein a completed thin film of a desired thickness, of at least one thin film material, is formed on the substrate either in a single unidirectional pass from the entrance section, through the coating section, to the exit section or by a single bi-directional pass in which the substrate passes only once from the entrance section, through the coating section, to the exit section, and returns only once through the coating section to the entrance section. |
