SEMICONDUCTOR CHIP PACKAGE AND METHOD FOR MANUFACTURING THEREOF

摘要

Disclosed herein is a semiconductor chip package, which includes a semiconductor chip, a plurality of vias, an isolation layer, a redistribution layer, and a packaging layer. The vias extend from the lower surface to the upper surface of the semiconductor chip. The vias include at least one first via and at least one second via. The isolation layer also extends from the lower surface to the upper surface of the semiconductor chip, and part of the isolation layer is disposed in the vias. The sidewall of the first via is totally covered by the isolation layer while the sidewall of the second via is partially covered by the isolation layer. The redistribution layer is disposed below the isolation layer and fills the plurality of vias, and the packaging layer is disposed below the isolation layer.

主权项

1. A semiconductor chip package, comprising:
a semiconductor chip having at least one sensor device and at least one connecting pad structure, wherein the sensor device is disposed on an upper surface of the semiconductor chip, and the connecting pad structure is electrically connected to the sensor device; a plurality of vias extending from a lower surface of the semiconductor chip to the upper surface of the semiconductor chip, wherein the plurality of vias comprises: at least one first via contacting the connecting pad structure and exposing a part of the connecting pad structure; and at least one second via without contacting the connecting pad structure; an isolation layer extending from the lower surface to the upper surface of the semiconductor chip, wherein a part of the isolation layer is disposed in the vias, and the part of the isolation layer is fully covering a sidewall of the first via and partially covering a sidewall of the second via; a redistribution layer disposed below the isolation layer and extending from the lower surface to the upper surface of the semiconductor chip, a part of the redistribution layer disposed in the vias, wherein the redistribution layer in the first via is electrically connected to the sensor device through the connecting pad structure; and a packaging layer disposed below the redistribution layer.