摘要 |
<p>The purpose of the present invention is to provide an imprinting method or an imprinting device that shorten resin filling time or reduce pattern loss and reduce resin surface roughness. The imprinting method for transferring a pattern onto a substrate by bringing a resin on the substrate and a mold in which the pattern is formed into contact is characterized by the following: being provided with a step wherein, with a space between the substrate and the mold filled with a prescribed gas, the resin on the substrate and the mold are brought into contact; a step wherein, with the resin and the mold being in contact, the resin is cured; and a step wherein the resin and the mold are separated; and in that the prescribed gas comprises, at 20°C and 1 atm, a first gas that has a solubility in the resin of at least 0.36 mol/L and a second gas that has a solubility in the resin of less than 0.36 mol/L.</p> |