发明名称 POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION AND CURED FILM PREPARED THEREFROM
摘要 <p>The present invention relates to a positive type photosensitive resin composition which comprises: copolymers (1) including an organization unit (1-1) induced from an unsaturated monomer containing a carboxyl group, an organization unit (1-2) induced from an unsaturated monomer containing a phenolic hydroxyl group, an organization unit (1-3) induced from an unsaturated monomer containing a lactone group and an organization unit (1-4) induced from an unsaturated monomer different from the organization unit (1-1) through the organization unit (1-3); and a photoresist (2), and to a cured film manufactured thereby. The positive type photosensitive resin composition of the present invention has excellent sensitivity and high normalized thickness after post cure and provides high pattern formability, thereby being usefully applied in manufacture of an insulation film for a liquid crystal display.</p>
申请公布号 KR20140092068(A) 申请公布日期 2014.07.23
申请号 KR20130004348 申请日期 2013.01.15
申请人 ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD. 发明人 PARK, SEOK BONG;CHOI, GYUNG SIK;KWEON, O YOUNG;LEE, HAG JU
分类号 G03F7/039;G03F7/004;G03F7/11 主分类号 G03F7/039
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