A LIGHT EMITTING DEVICE PACKAGE

摘要

An embodiment provides a light emitting device package comprising a light emitting device which has a substrate, a first semiconductor layer, an active layer, and a second semiconductor layer, divided into a plurality of light emitting cells, and placed under the substrate; and a submount which has at least one conductive layer and is located under the light emitting device. The light emitting cells are electrically separated from each other. At least one conductive layer connects the light emitting cells in series.