Three dimensional microelectronic components and fabrication methods for same

摘要

Aspects and examples include electrical components and methods of forming electrical components. In one example, a method includes selecting a substrate, forming a pattern of a first conductive material on a top surface of the substrate, forming a pattern of a second conductive material on a bottom surface of the substrate, dicing the substrate into one or more die having a first diced surface and a second diced surface, securing the first diced surface of each of the one or more die to a retaining material, encapsulating the one or more die in an encapsulent to form a reconstituted wafer, and forming a pattern of a third conductive material on the second diced surface by metalizing a surface of the reconstituted wafer.

主权项

1. A method of forming an electrical component, the method comprising:
selecting a substrate; forming a pattern of a first conductive material on a top surface of the substrate; forming a pattern of a second conductive material on one of a bottom surface of the substrate and a dielectric layer formed over the pattern of the first conductive material; dicing the substrate into a plurality of dies each having a first diced surface and a second diced surface, the first diced surface and the second diced surface formed by the dicing of the substrate; securing the first diced surface of each of the plurality of dies to a retaining material; encapsulating the plurality of dies in an encapsulent to form a reconstituted wafer; and forming a pattern of a third conductive material on the second diced surfaces by metalizing a surface of the reconstituted wafer.