| 摘要 |
A semiconductor device includes a substrate having a first surface, a height adjuster mounted on the first surface of the substrate via a first adhesive layer, a semiconductor chip mounted on the height adjuster via a second adhesive layer, an electronic component mounted on the first surface of the substrate via a third adhesive layer, a bonding wire, and a sealing member. The length of the electronic component in a first direction corresponding to the thickness direction of the substrate is larger than the length of the semiconductor chip in the first direction, and the sum of the lengths of the height adjuster, the second adhesive layer, and the semiconductor chip in the first direction is larger than the length of the electronic component in the first direction. |
| 主权项 |
1. A semiconductor device, comprising:
a substrate; a height adjuster mounted on a surface of the substrate via a first adhesive layer; a semiconductor chip mounted on the height adjuster via a second adhesive layer; an electronic component mounted on the surface of the substrate via a third adhesive layer and disposed apart from the height adjuster and the semiconductor chip; a bonding wire electrically connecting a conductive pad disposed on the substrate and a conductive pad disposed on the semiconductor chip to electrically connect the conductive pad disposed on the substrate and the conductive pad disposed on the electronic component; and a sealing member covering the substrate, the first adhesive layer, the height adjuster, the second adhesive layer, the semiconductor chip, the third adhesive layer, the electronic component, and the bonding wire, wherein the length of the electronic component in a first direction corresponding to the thickness direction of the substrate is larger than the length of the semiconductor chip in the first direction, and the sum of the lengths of the height adjuster, the second adhesive layer, and the semiconductor chip in the first direction is larger than the length of the electronic component in the first direction. |
