Image sensor including a deep trench isolation (DTI)that does not contact a connecting element physically

摘要

An image sensor includes a substrate with a front side and a back side, the substrate having a sensor array region and a peripheral region defined thereon, a plurality of sensor device disposed in the sensor array region, a first metal layer disposed on the front sides within the peripheral region, a bonding pad disposed on the backside within the peripheral region, and at least a connecting element penetrating the substrate and substantially connect to the first metal layer and the bonding pad, wherein parts of the substrate is between the bonding pad and the first metal layer.

主权项

1. An image sensor, comprising:
a substrate with a front side and a back side, wherein the substrate has a sensor array region and a peripheral region defined thereon; a plurality of image sensor devices disposed in the sensor array region; a first metal layer disposed on the front side within the peripheral region; a bonding pad disposed on the back side within the peripheral region; at least one connecting element penetrating the substrate and substantially contacting to the first metal layer and the bonding pad, wherein parts of the substrate are between the first metal layer and the bonding pad; at least one deep trench isolation (DTI) disposed in the substrate surrounding the bonding pad, wherein the DTI does not contact the connecting element physically.