Multi-chip socket

摘要

A multi-chip socket includes multiple cavities. The multiple cavities include support surfaces. The support surfaces may be disposed at different heights relative to a reference plane. The different heights may be based on a height of a first component to be disposed in the first cavity and a height of a second component to be disposed in a second cavity.

主权项

1. An apparatus comprising:
a multi-chip socket comprising:
a first cavity having a first support surface to support a first component including a first chip, the first support surface arranged to contact and support the first chip, and the first support surface being at a first height with respect to a reference plane; anda second cavity electrically coupled to the first cavity and having a second support surface to support a second component including a second chip, the second support surface arranged to contact and support the second chip, and the second support surface being at a second, different height with respect to the reference plane, wherein the first height is based on a height of the first component, and the second height is based on a height of the second component; and a single heat extraction device arranged to thermally connect to a top surface of the first component and a top surface of the second component, the top surfaces being coplanar.