Method and apparatus providing integrated circuit having redistribution layer with recessed connectors

摘要

A method of making a semiconductor die includes forming a trench around a conductive stud extending from the first side to a second side of a substrate to expose a portion of the stud and then forming a conductive layer inside the trench and in electrical contact with the stud.

主权项

1. An electronic device comprising:
a semiconductor die comprising: a substrate; integrated circuitry arranged in a first surface of the substrate; a trench arranged in a second surface of the substrate; a first dielectric layer arranged within the trench; a conductive redistribution layer wholly contained within the trench and on the first dielectric layer, the conductive redistribution layer being electrically coupled to the integrated circuitry; and a conductive stud electrically coupling the integrated circuitry to the conductive redistribution layer; wherein the conductive redistribution layer comprises a first bond pad, a second bond pad and a conductive trace electrically coupling the second bond pad to the first bond pad.