| 摘要 |
<p>Provided is a circuit board (10) with a buried resistor. The circuit board (10) comprises an insulation substrate (11), at least one pair of electrodes (12) and a resistance layer (13). The at least one pair of electrodes (12) are arranged on the surface of the insulation substrate (11), and each pair of electrodes (12) comprise a first electrode (120) and a second electrode (121). The first electrode (120) comprises a first body (120a) and a first guard fence (120b) connected to the first body (120a). The second electrode (121) is arranged opposite to and separated from the first electrode (120), and the second electrode (121) comprises a second body (121a) and a second guard fence (121b) connected to the second body (121a). The resistance layer (13) is formed on the insulation substrate (11) among the first body (120a), the second body (121a), the first guard fence (120b) and the second guard fence (121b). The circuit board (10) with a buried resistor buries the resistor in the circuit board (10). Compared with a circuit board manufactured using surface mounting technology (SMT), the welding points of components are reduced, the stability of assembled components is improved, the signal crosstalk is reduced, and the increasingly strict requirements for light and thin products are met.</p> |
