| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a wiring board which hardly induces disconnection in a lead wiring line in an opening of a solder resist layer.SOLUTION: The wiring board comprises: an insulating substrate 1 having a mounting part in an upper surface center part where a semiconductor element is to be mounted; a great number of semiconductor element connection pads 5 arranged parallel to one another along an outer periphery of the semiconductor element and disposed in an outer periphery of the mounting part on the insulating substrate 1; a lead wiring line 6 extending from the semiconductor element connection pad 5 toward the center part side of the mounting part on the insulating substrate 1; and a solder resist layer 3 which is applied to the upper surface of the insulating substrate 1, has an opening 3a where the semiconductor element connection pad 5 and a part of the lead wiring line 6 are exposed and the lead wiring line 6 intersects an inner circumference 3ai of the opening, and which covers the rest of the lead wiring line 6. In the lead wiring line 6, at least a part of the rest of the line is subjected to a roughening treatment; and a width of the part intersecting the inner circumference 3ai is larger than a width of a part extending from the intersecting part toward the center part side.</p> |
