发明名称 APPARATUS OF FORMING ELECTROCONDUCTIVE SUBSTANCE AND METHOD OF FORMING THE SAME
摘要 An apparatus forms an electroconductive substance in micro holes, the apparatus introduces a fluid, that includes at least a metal complex dissolved in a supercritical fluid or a subcritical fluid, into a reaction chamber including a first space and a second space, allows a planar substrate to be disposed in the fluid that continuously moves in a specific direction in the reaction chamber. A second surface of the substrate is vertical to the specific direction in which the fluid that is introduced into the first space moves; the substrate is supported throughout the entire first surface so that the fluid travels in the micro holes of the substrate from the second surface toward the first space of the substrate; and a support member including a fine communication hole through which the fluid passes toward the second space is disposed.
申请公布号 US2014193573(A1) 申请公布日期 2014.07.10
申请号 US201414206615 申请日期 2014.03.12
申请人 FUJIKURA LTD. ;UNIVERSITY OF YAMANASHI 发明人 KONDOH Eiichi;MATSUBARA Masahiro;TAKEUCHI Yuto;WATANABE Mitsuhiro;YAMAMOTO Satoshi;KIKUKAWA Naohiro
分类号 C23C18/40;C23C18/31 主分类号 C23C18/40
代理机构 代理人
主权项 1. An apparatus of forming an electroconductive substance comprising: a reaction chamber including a first space into which a fluid is introduced and a second space through which the fluid is discharged, the fluid including at least a metal complex dissolved in a supercritical fluid or a subcritical fluid; and a support member which supports a planar substrate which is disposed in the fluid that continuously moves in a specific direction in the reaction chamber, and includes a first surface, a second surface, and micro holes, the support member supporting the substrate throughout an entire first surface so that the second surface of the substrate is vertical to the specific direction in which the fluid that is introduced into the first space moves and so that the fluid travels in the micro holes of the substrate from the second surface toward the first surface of the substrate, and includes fine communication holes through which the fluid passes toward the second space.
地址 Tokyo JP