ELECTRONIC SUBSTRATE AND AN ELECTRONIC APPARATUS

摘要

An electronic substrate 100D has a tabular base material 110 which can install a heater element 120 and the cooling structure that cools the heater element 120. An electronic substrate 100 can be plugged in/out in the case 200 in the direction which is almost parallel to the face of the base material 110. The cooling structure is installed on the tabular base material 110, and has the first heat radiation part 160D with a hollow shape and the heat transfer part 700. The first heat radiation part 160D with a hollow shape radiates the generated heat of the heater element 120 installed in the base material. The heat transfer part 700 transfers the generated heat of the heater element 120 to the first heat radiation part 160D. The first heat radiation part 160D has the first joint surface 165 formed along a face which is almost vertical to the insert and removal direction W of the base material 110. The first heat radiation part 160D is connected to the second radiation part 260B set up in the case 200 thermally through the first joint surface 165. As a result, the generated heat of the heater element can be radiated sufficiently.

主权项

1. An electronic substrate including a tabular base material which can install a heater element and a cooling structure which cools the generated heat of the heater element, in which the base material is possible to be plugged in and out in a case to the direction which is almost parallel to the surface of the base material,
the cooling structure provided for the base material is equipped with a first heat radiation part with a hollow shape that radiates the generated heat of the heater element installed in the base material, and a heat transfer part that transfers the generated heat of the heater element to the first heat radiation part, and the first heat radiation part is equipped with a first joint surface that is a face which is almost vertical to the insert and removal direction of the base material, and connects with a second heat radiation part installed thermally in the case through the first joint surface.