PRINTED CIRCUIT BOARD, AND SURFACE TREATMENT METHOD OF THE PRINTED CIRCUIT BOARD

摘要

The present invention relates to a printed circuit board comprising a copper foil layer of which the surface is treated with lead-free solder (Pb-free solder) of equivalent level of the level of solder resist, and to a surface treatment method of a printed circuit board. According to the present invention, the surface treatment of a package substrate or an interposer substrate of the ultrafine pitch (300 micrometers or less) size can be easily carried out as a low cost process. Moreover, the surface treatment of a printed circuit board can be carried out through an environmentally friendly process by using lead-free solder (Pb-free solder), and the surface treatment of a package substrate or an interposer substrate based on a high temperature-sensitive organic material is easily carried out.