Semiconductor package with integrated interference shielding and method of manufacture therof

摘要

An integrated electromagnetic interference (EMI) shield for a semiconductor module package. The integrated EMI shield includes a plurality of wirebond spring (216) electrically connected between a ground plane (212) in the substrate (204) of the package and a conductive layer (222) printed on the top of the package mold compound. The wirebond springs have a defined shape that causes a spring effect to provide contact electrical connection between the tops of the wirebond springs and the conductive layer. The wirebond springs can be positioned anywhere in the module package, around all or some of the devices (202) included in the package, to create a complete EMI shield around those devices.