Manufacturing method of optical electronic components and optical electronic components manufactured using the same

摘要

There is provided a method of sealing and molding an optical device with resin by employing a die including a top piece, a bottom piece, an intermediate piece, and a mold release film pinched between the bottom and intermediate pieces. Thus, tensioned as prescribed to cover the bottom piece's cavity, when the bottom piece is heated, the mold release film expands and thus closely contacts the cavity's entire surface along the cavity's geometry so that the optical device can be sealed in transparent set resin shaped as desired.

主权项

1. A resin-sealing and molding method of optical devices employing a resin-sealing and molding die comprising a lower molding die provided with a cavity, an upper molding die opposing said lower molding die, and a release film covering a cavity surface of said cavity, and resin-sealing and molding a plurality of optical devices in said cavity, wherein
said method comprises: attaching, to said upper molding die, a substrate before sealing to which said plurality of optical devices are attached so that said plurality of optical devices overlap with a plurality of concave portions provided in said cavity in plan view respectively; bringing said mold release film into contact with all surfaces of an entire cavity corresponding to a geometry of said cavity; inserting said plurality of optical devices into melted resin or resin in liquid form in said cavity by closing said resin-sealing and molding die; setting said melted resin or said resin in liquid form to provide transparent set resin; opening said resin-sealing and molding die; and removing said substrate sealed by said transparent set resin from said resin-sealing and molding die, wherein said lower molding die defines a communicating path communicating said plurality of concave portions with each other at an entire periphery of each of said plurality of concave portions, in said inserting step, said melted resin or said resin in liquid form moves between said plurality of concave portions through said communicating path so that a space inside said cavity is filled with said melted resin or said resin in liquid form when said resin-sealing and molding die is closed.