RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD, INSULATING FILM, PREPREG AND PRINTED CIRCUIT BOARD

摘要

The present invention relates to a resin composition for a printed circuit board including a hardener and a composite epoxy resin comprising a bisphenol A type epoxy resin, a cresol novolac epoxy resin, a rubber modified epoxy resin, a phosphorus based epoxy resin and an alkyl sulfonated tetrazole modified epoxy resin; an insulation film; a prepreg; and a printed circuit board. The insulation film and the prepreg according to the present invention basically have low thermal expansion coefficient and exhibit excellent heat resistance, high glass transition temperature and excellent metal adhesive strength.