发明名称 RESIST MATERIAL, METHOD FOR FORMING PATTERN USING THE SAME, AND POLYMERIC COMPOUND
摘要 PROBLEM TO BE SOLVED: To provide a resist material giving such a photoresist film that reduces an outgas from a resist film in EUV exposure, and reduces an edge roughness (LWR) after development, and suppresses the occurrence of blob defects on the resist film after development by hydrophilizing the surface of the resist film.SOLUTION: There is provided a resist material comprising: a polymeric compound, as a base resin, whose alkali solubility is improved by an acid; and a polymeric compound including a repeating unit p represented by general formula (1) as a polymeric additive. In the formula, Rrepresents a linear or branched alkylene group having 1 to 4 carbon atoms; and p satisfies 0<p&le;1.0.
申请公布号 JP2014126623(A) 申请公布日期 2014.07.07
申请号 JP20120281961 申请日期 2012.12.26
申请人 SHIN ETSU CHEM CO LTD 发明人 HATAKEYAMA JUN;HASEGAWA KOJI;FUNATSU AKIYUKI
分类号 G03F7/004;C08F12/22;G03F7/039;H01L21/027 主分类号 G03F7/004
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