发明名称 |
THERMAL TREATMENT DEVICE FOR SUBSTRATE |
摘要 |
The present invention relates to a heat treatment device for substrate which simultaneously performs a thermal process on multiple substrates and facilitates maintenance. The present invention, in a heat treatment device for substrate which includes a heating chamber which performs a thermal process on multiple substrates, provides a heat treatment device for a substrate which includes a heating chamber which includes a chamber outer wall of an outer wall, a front door which is formed in one side of the chamber outer wall and opens/closes to load and unload the substrate, and a heating module which can be drawn from the inner part of the heating chamber to the outer part of the heating chamber and supports and heats the substrate. |
申请公布号 |
KR20140083306(A) |
申请公布日期 |
2014.07.04 |
申请号 |
KR20120152893 |
申请日期 |
2012.12.26 |
申请人 |
TOP ENGINEERING CO., LTD. |
发明人 |
JEON, HONG HEE;CHOI, SEOG JIN |
分类号 |
H01L21/324;H01L21/02 |
主分类号 |
H01L21/324 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|