发明名称 THERMAL TREATMENT DEVICE FOR SUBSTRATE
摘要 The present invention relates to a heat treatment device for substrate which simultaneously performs a thermal process on multiple substrates and facilitates maintenance. The present invention, in a heat treatment device for substrate which includes a heating chamber which performs a thermal process on multiple substrates, provides a heat treatment device for a substrate which includes a heating chamber which includes a chamber outer wall of an outer wall, a front door which is formed in one side of the chamber outer wall and opens/closes to load and unload the substrate, and a heating module which can be drawn from the inner part of the heating chamber to the outer part of the heating chamber and supports and heats the substrate.
申请公布号 KR20140083306(A) 申请公布日期 2014.07.04
申请号 KR20120152893 申请日期 2012.12.26
申请人 TOP ENGINEERING CO., LTD. 发明人 JEON, HONG HEE;CHOI, SEOG JIN
分类号 H01L21/324;H01L21/02 主分类号 H01L21/324
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