| 摘要 |
Provided is a pressure control regulator for a chemical mechanical polishing apparatus, including: a main supply valve disposed between supply pipes, which are supplied by a fluid from a pressure supply unit and transmit the fluid to a rotary union, to control fluid supply; a sub-supply valve disposed between the supply pipes to control fluid supply to the rotary union, separately from the main supply valve; a main release valve disposed between discharge pipes, which discharge the fluid transmitted to the rotary union, to control discharge of the fluid; a sub-release valve controlling the discharge of the fluid transmitted to the rotary union, separately from the main release valve; and a valve control unit controlling operations of the main supply valve, the sub-supply valve, the main release valve, and the sub-release valve. The main supply valve and the main release valve adjust the supply and release pressure of the fluid in a wide range, but the sub-supply valve and the sub-release valve adjust the supply and release pressure of the fluid in a fine range, thereby improving a reaction speed which reaches preset pressure, and decreasing pressure variations in which the pressure range is higher or lower than a reference value. |
