| 摘要 |
The present invention relates to a complex vacuum deposition method for selectively performing one method among an electron beam vacuum deposition method and a sputtering method by selectively replacing and installing an electron beam vacuum deposition device and a sputtering vacuum deposition device in one vacuum chamber. The management is easy and costs for production and maintenance are remarkably reduced as one method among the electron beam vacuum deposition method and the sputtering method can be selectively performed by selectively replacing and installing the electron beam vacuum deposition device and the sputtering vacuum deposition device in one vacuum chamber. |
