| 摘要 |
The purpose of the present invention is to provide a low-melting-point glass resin composite material wherein heat resistance and heat conductivity of an insulating resin are improved. This low-melting-point glass resin composite material is characterized in containing: a lead-free low-melting-point glass composition, which contains Ag2O, V2O5 and TeO2, and in which a total content rate of Ag2O, V2O5 and TeO2 is 75 mass% or more; and a resin composition wherein the 5% thermal weight reduction temperature thereof is equal to or higher than the softening point temperature of the low-melting-point glass composition. |
