| 发明名称 |
OPTOELECTRONIC PACKAGE AND METHOD OF MANUFACTURING THE SAME |
| 摘要 |
An optoelectronic package includes an optoelectronic chip, a transparent protection layer and a plurality of pads. The optoelectronic chip has an upper surface and an active area defined on the upper surface. The transparent protection layer is connected to the optoelectronic chip and covers the upper surface. The transparent protection layer touches and is entirely attached to the active area. The pads are electrically connected to the optoelectronic chip. |
| 申请公布号 |
US2014183591(A1) |
申请公布日期 |
2014.07.03 |
| 申请号 |
US201314141868 |
申请日期 |
2013.12.27 |
| 申请人 |
APTOS TECHNOLOGY INC. |
发明人 |
JOW EN-MIN;LO CHI-JANG;LIN NAN-CHUN;CHANG CHIEN SHANG YU |
| 分类号 |
H01L31/0203;H01L31/18;H01L33/56 |
主分类号 |
H01L31/0203 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An optoelectronic package comprising:
an optoelectronic chip having an upper surface and an active area defined on the upper surface; a transparent protection layer connected to the optoelectronic chip and covering the upper surface, wherein the transparent protection layer touches and is entirely attached to the active area; and a plurality of pads electrically connected to the optoelectronic chip. |
| 地址 |
HSIN-CHU TW |
