| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an alignment mark that allows an alignment state of a chip laminate to be determined even when a plurality of the same type of semiconductor chips are laminated, and a method for manufacturing a laminated semiconductor including a method for inspecting alignment accuracy using the alignment mark.SOLUTION: The shape of alignment marks formed into the same shape at the same in-plane position on surfaces of plural semiconductor chips to be laminated is designed so that the alignment marks on different chips are arranged away from each other with a predetermined gap therebetween or in such a manner as to overlap with each other with a predetermined amount of protrusion when viewed at a predetermined angle from a chip surface. The predetermined gap or amount of protrusion is designed so that the gap and/or amount of protrusion disappears when the chips have the maximum amount of displacement allowed by specifications of alignment accuracy. A method for inspecting alignment accuracy, includes radiating electromagnetic waves that transmit a substrate of semiconductor chips and observing a gap between alignment marks or the amount of protrusion, thereby determining an alignment state.</p> |
