| 发明名称 |
METHOD OF ELECTROLESS INTRODUCTION OF INTERCONNECT STRUCTURES |
| 摘要 |
<p>An apparatus including a substrate comprising a device having contact point; a dielectric layer overlying the device with an opening to the contact point; and an interconnect structure disposed in the opening including an interconnect material and a different conductive shunt material.</p> |
| 申请公布号 |
EP1346408(B1) |
申请公布日期 |
2014.07.02 |
| 申请号 |
EP20010993180 |
申请日期 |
2001.11.15 |
| 申请人 |
INTEL CORPORATION |
发明人 |
MCGREGOR, PAUL, J.;THOMAS, CHRISTOPHER;DATTA, MADHAV;DUBIN, VALERY |
| 分类号 |
H01L21/768;H01L21/288;H01L23/532 |
主分类号 |
H01L21/768 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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