Three dimensional passive multi-component structures

摘要

Stacked arrays of components are disclosed. In one embodiment, a first and a second layer of components are electrically and mechanically coupled to an interposer with an encapsulated third layer of components disposed between the first and second layers. The first layer can be configured to attach the stacked array to a host printed circuit board. The interposer can couple signals between the components on the first and second layers.

主权项

1. A vertically stacked integrated array, comprising:
a substrate having a first surface and a second surface, the second surface opposite the first surface; a first passive component coupled to the first surface; a support component coupled to the second surface and suitable for mechanical attachment to a host printed circuit board (PCB) such that the support component substantially supports the vertically stacked integrated array on the host PCB, wherein the support component comprises a first discrete terminal and a second discrete terminal, the first discrete terminal configured to electrically couple the support component to an external circuit arranged on the host PCB; edge plating disposed along a first edge and a second edge of the substrate, the edge plating electrically coupling the first passive component to the second discrete terminal; a second passive component encapsulated within the substrate, the second passive component disposed between the first edge and the second edge of the substrate; and an electrically conductive pathway disposed substantially within the substrate, the electrically conductive pathway electrically coupling the second passive component to the support component.