| 发明名称 | Dicing tape-integrated wafer back surface protective film | ||
| 摘要 | The present invention provides a dicing tape-integrated wafer back surface protective film including: a dicing tape including a base material and a pressure-sensitive adhesive layer formed on the base material; and a wafer back surface protective film formed on the pressure-sensitive adhesive layer of the dicing tape, in which the wafer back surface protective film is colored. It is preferable that the colored wafer back surface protective film has a laser marking ability. The dicing tape-integrated wafer back surface protective film can be suitably used for a flip chip-mounted semiconductor device. | ||
| 申请公布号 | US8766462(B2) | 申请公布日期 | 2014.07.01 |
| 申请号 | US201314095230 | 申请日期 | 2013.12.03 |
| 申请人 | Nitto Denko Corporation | 发明人 | Takamoto Naohide;Matsumura Takeshi |
| 分类号 | H01L23/48;H01L23/52;H01L29/40 | 主分类号 | H01L23/48 |
| 代理机构 | Sughrue Mion, PLLC | 代理人 | Sughrue Mion, PLLC |
| 主权项 | 1. A dicing tape-integrated wafer back surface protective film comprising: a dicing tape comprising a base material and a pressure-sensitive adhesive layer formed on the base material; and a wafer back surface protective film formed on the pressure-sensitive adhesive layer of the dicing tape, wherein the wafer back surface protective film is colored, wherein said colored wafer back surface protective film has an elastic modulus at 23° C. of 1 GPa or more, and wherein said colored wafer back surface protective film has a ratio of weight decrease of 1% by weight or less after heating at a temperature of 250° C. for 1 hour. | ||
| 地址 | Osaka JP | ||