发明名称 LASER PROCESSING METHOD
摘要 PROBLEM TO BE SOLVED: To reduce a risk of damage to a holding table due to irradiation with a laser beam.SOLUTION: A workpiece W is suctionally held on a holding surface 54 of a holding table 51 with a scatter sheet 100, having a larger size than an irradiation area for a laser beam L, interposed (holding step), and an altered layer W1 is formed by irradiating the inside of the workpiece W with the laser beam L along a predetermined division line (laser processing step). The laser beam L travels to outside an outer peripheral edge of the workpiece W within the irradiation area La, but is prevented from irradiating the holding table 51 directly by being made to irradiate the scatter sheet 100 to be scattered.
申请公布号 JP2014117707(A) 申请公布日期 2014.06.30
申请号 JP20120272095 申请日期 2012.12.13
申请人 DISCO ABRASIVE SYST LTD 发明人 FUJIWARA SEIJI
分类号 B23K26/18;B23K26/10;B23K26/38;H01L21/301 主分类号 B23K26/18
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