| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor stacking cooling unit in which damage on an insulating plate can be prevented, and a semiconductor element can be cooled sufficiently when compared with prior art.SOLUTION: A semiconductor stacking cooling unit includes a multi-stage stack 10 where semiconductor elements 2, and cooling plates 3 each having a flow path internally are stacked alternately in the thickness direction, and compression force application means 11 for applying a compression force to the stack 10 from both end sides thereof in the stacking direction. The stack 10 has an insulating plate 4 between the semiconductor element 2 and cooling plate 3, the cooling plate 3 has a recess 30 recessed from the plane facing the semiconductor element 2 to the flow path side, and the recess 30 is arranged on the outside of the semiconductor element 2 and insulating plate 4. |
