发明名称 COOLING APPARATUS
摘要 <p>PROBLEM TO BE SOLVED: To obtain a cooling apparatus capable of suppressing variation in cooling performance for heating elements even when the number of heating elements to be mounted is increased.SOLUTION: Upper and lower heat sinks 10 and 11 are mounted so as to close upper and lower openings of a main body part 2, and a partition plate 3 is disposed so as to vertically bisect the inside of the main body part. A cooling liquid supply header is provided in the center in the width direction between the upper heat sink 10 and the partition plate 3 and a cooling liquid discharge header is provided, in parallel with the cooling liquid supply header, in the center in the width direction between the lower heat sink 11 and the partition plate 3. At both sides in the width direction, a vertical flow passage 9 is provided in parallel with the cooling liquid supply header while vertically penetrating the partition plate 3. A cooling liquid distribution structure body 8 is disposed within the cooling liquid supply header, and formed in such an outer shape that a flow passage sectional area of the cooling liquid supply header becomes gradually small from an upstream side to a downstream side.</p>
申请公布号 JP2014116404(A) 申请公布日期 2014.06.26
申请号 JP20120268346 申请日期 2012.12.07
申请人 MITSUBISHI ELECTRIC CORP 发明人 TOCHIYAMA SHIGENOBU;HASHIMO SEIJI;TAMURA MASAYOSHI;ISHIBASHI SEIJI;IDENOUE SHINSUKE
分类号 H01L23/473;H05K7/20 主分类号 H01L23/473
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