发明名称 CONDUCTIVE FILM, PRECURSOR FILM THEREOF AND METHOD FOR PRODUCING CONDUCTIVE FILM
摘要 <p>The purpose of the present invention is to provide: a conductive film which has high electrical conductivity and excellent adhesion to a base, while being suppressed in the occurrence of curl; a precursor film which is capable of forming the conductive film; and a method for producing the conductive film. A precursor film of the present invention is provided on a base and used for the formation of a conductive film that contains copper metal. This precursor film comprises copper oxide particles and an inactive resin that does not undergo a polymerization reaction or a crosslinking reaction by means of light or heat. In the entire thickness of the precursor film from the surface-side surface to the base-side surface, the content ratio of the copper oxide particles present in an upper region, which is a region corresponding to 1/3 of the entire thickness of the precursor film from the surface side toward the base side, is higher than the content ratio of the copper oxide particles present in a lower region, which is a region corresponding to 1/3 of the entire thickness of the precursor film from the base side toward the surface side; and the content ratio of the inactive resin present in the upper region is lower than the content ratio of the inactive resin present in the lower region.</p>
申请公布号 WO2014097817(A1) 申请公布日期 2014.06.26
申请号 WO2013JP81434 申请日期 2013.11.21
申请人 FUJIFILM CORPORATION 发明人 KASAI SEISHI
分类号 H01B5/14;B32B27/18;H01B13/00 主分类号 H01B5/14
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