发明名称 ETCHING SOLUTION AND METHOD OF FORMING CONDUCTIVE PATTERN
摘要 The invention provides a copper etching solution capable of maintaining top shapes of patterns and etching at the same time even being used continuously or repeatedly, and a method for forming conductor patterns by using the etching solution. The etching solution is characterized in that the copper etching solution contains a copper ion source, acid and water, azole and an aromatic compound, wherein the azole only has a nitrogen atom as a hetero atom existed in a ring, and the aromatic compound is at least one selected from phenols and aromatic amines. In addition, the method for forming the conductor patterns is characterized by comprising the step of using the etching solution to etch the part of a copper layer not covered by etchant (3), so as to form the conductor patterns (2).
申请公布号 KR101412281(B1) 申请公布日期 2014.06.25
申请号 KR20080086556 申请日期 2008.09.03
申请人 发明人
分类号 C09K13/00 主分类号 C09K13/00
代理机构 代理人
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