发明名称 EPOXY RESIN COMPOSITE, PREPREG AND PRINTED CIRCUIT BOARD USING THE SAME
摘要 An epoxy resin composition according to an embodiment of the present invention comprises: an epoxy compound represented by the following chemical formula; a hardening agent; and an inorganic filler including spherical alumina (Al2O3). In the chemical formula, R1 to R6 can be independently selected from the group consisting of H, Cl, Br, F, C1-C3 alkyl, C1-C3 alkene, and C1-C3 alkyne, and n is 1, 2, or 3.
申请公布号 KR20140077558(A) 申请公布日期 2014.06.24
申请号 KR20120146498 申请日期 2012.12.14
申请人 LG INNOTEK CO., LTD. 发明人 PARK, JAE MAN;KIM, MYEONG JEONG;YOON, JONG HEUM;PARK, JEUNG OOK;YUN, SUNG JIN
分类号 C08L63/00;C08G59/22;C08J5/24;C08K3/22 主分类号 C08L63/00
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