| 发明名称 | Method of producing laminated device | ||
| 摘要 | A method of producing a laminate insert package includes providing a first metal layer, printing a first dielectric layer on the first metal layer, providing a second metal layer, printing a second dielectric layer on the second metal layer, and printing a dielectric spacer layer on the first dielectric layer. At least one semiconductor chip is attached to either the first or the second metal layer. A first layer assembly comprising the first metal layer, the first dielectric layer, the dielectric spacer layer and a second layer assembly comprising the second metal layer and the second dielectric layer are brought together. The first and second layer assemblies are laminated to form a laminate insert package, whereby the at least one semiconductor chip is embedded within the laminate insert package. | ||
| 申请公布号 | US8759156(B2) | 申请公布日期 | 2014.06.24 |
| 申请号 | US201213618280 | 申请日期 | 2012.09.14 |
| 申请人 | Infineon Technologies AG | 发明人 | Standing Martin |
| 分类号 | H01L21/00 | 主分类号 | H01L21/00 |
| 代理机构 | Dicke, Billig & Czaja, PLLC | 代理人 | Dicke, Billig & Czaja, PLLC |
| 主权项 | 1. A method of producing a laminate insert package comprising: providing a first metal layer; printing a first dielectric layer on the first metal layer; providing a second metal layer; printing a second dielectric layer on the second metal layer; printing a dielectric spacer layer on the first dielectric layer; attaching at least one semiconductor chip to either the first or the second metal layer; bringing a first layer assembly comprising the first metal layer, the first dielectric layer, the dielectric spacer layer and a second layer assembly comprising the second metal layer and the second dielectric layer together; and laminating the first and second layer assemblies to form the laminate insert package, whereby the at least one semiconductor chip is embedded within the laminate insert package. | ||
| 地址 | Neubiberg DE | ||