发明名称 Standard cell for semiconductor device
摘要 A standard cell for a semiconductor device has first and second opposing boundaries and third and fourth opposite boundaries, and includes first and second active regions formed in a semiconductor substrate. The first and second active regions are a first predetermined distance (a) from the first and second boundaries, respectively. A gate electrode is formed over the first and second active regions. First and second dummy diffusions layers are formed along the third boundary and are the first predetermined distance (a) from the first and second boundaries and a second predetermined distance (b) from the first and second active regions, respectively. Third and fourth dummy diffusions layers are formed along the fourth boundary and are the first predetermined distance (a) from the first and second boundaries and a third predetermined distance (b′) from the first and second active regions, respectively.
申请公布号 US8759885(B1) 申请公布日期 2014.06.24
申请号 US201313873217 申请日期 2013.04.30
申请人 Freescale Semiconductor, Inc. 发明人 Jain Ankit;Tripathi Vikas
分类号 H01L27/10;H01L27/118;H01L27/092 主分类号 H01L27/10
代理机构 代理人 Bergere Charles
主权项 1. A semiconductor device, comprising: a rectangular standard cell defined in a semiconductor substrate and having first, second, third, and fourth boundaries, wherein the first and second boundaries are on opposite ends of the standard cell, and wherein the third and fourth boundaries are on opposite ends of the standard cell, the standard cell comprising: a plurality of active regions including first and second active regions formed in the semiconductor substrate, and having a first spacing distance (a) from the first and second boundaries, respectively;at least one gate electrode strip formed over the first and second active regions;first and second dummy diffusion layers formed in the semiconductor substrate, wherein the first and second dummy diffusion layers extend along the third boundary and have the first spacing distance (a) from the first and second boundaries and a second spacing distance (b) from the first and second active regions, respectively; andthird and fourth dummy diffusion layers formed in the semiconductor substrate, wherein the third and fourth dummy diffusion layers extend along the fourth boundary and have the first spacing distance (a) from the first and second boundaries and a third spacing distance (b′) from the first and second active regions, respectively.
地址 Austin TX US