B-stageable and skip-curable wafer back side coating adhesives

摘要

An adhesive composition comprising elastomeric polymer, epoxy resin, reactive diluent, and filler, is suitable for use within the electronics industry, and in particular for wafer back side coating adhesives. The elastomeric polymer is a mixture of a vinyl elastomer and an epoxy elastomer; the reactive diluent is a combination of two or more diluents, one of which must have carbon to carbon unsaturation, providing cross-linking within the composition after cure; and the filler is a non-conductive filler.

主权项

1. An adhesive composition comprising:
(A) an elastomeric polymer comprising a mixture of a vinyl elastomer and an epoxy elastomer, the mixture present in an amount within the range of 20% to 40% by weight, (B) an epoxy resin, present in the adhesive composition in the range of 3% to 10% by weight, (C) reactive diluent comprising a combination of two or more diluents, one of which must have carbon to carbon unsaturation, the combination present in the adhesive composition within the range of 35% to 50% by weight of the composition, (D) a curing agent, and (E) filler, sufficient to bring the total of the composition to 100% by weight.