PRINTED CIRCUIT BOARD FOR SMART IC, METHOD FOR MANUFACTURING THE SAME AND SMART IC CHIP PACKAGE

摘要

The present invention has effects of reducing manufacturing costs and improving corrosion resistance and chemical resistance by providing a printed circuit board for a smart IC which comprises an insulating layer in which a through hole is formed; a circuit pattern layer made up of aluminum which is formed on the insulating layer; and a surface treatment layer formed by chemical conversion coating the circuit pattern layer.