| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive film capable of improving the reliability of a solder joint part.SOLUTION: An adhesive film 10 is used when circuit members, in each of which a circuit is formed, are connected electrically to each other and has a base material layer 13 and adhesive layers 11, 12. Each of the adhesive layers contains a filler, an epoxy resin and a compound having a curing agent. The filler content on the first surface of the adhesive layer, which is in contact with the base material layer 13, is made different from that on the second surface of the adhesive layer, which is on the opposite side of the first surface. |
