发明名称 COMPONENTS WITH POROUS METAL COOLING AND METHODS OF MANUFACTURE
摘要 A manufacturing method includes providing a substrate with an outer surface and at least one interior space and machining the substrate to selectively remove a portion of the substrate and define one or more cooling supply holes therein. Each of the one or more cooling supply holes is in fluid communication with the at least one interior space. The method further includes disposing an open cell porous metallic layer on at least a portion of the substrate. The open cell porous metallic layer is in fluid communication with the one or more cooling supply holes. A coating layer is disposed on the open cell porous metallic layer. The coating layer having formed therein one or more cooling exit holes in fluid communication with the open cell porous metallic layer. The substrate, the one or more cooling supply holes, the open cell porous metallic layer and the cooling exit holes providing a cooling network for a component.
申请公布号 US2014169943(A1) 申请公布日期 2014.06.19
申请号 US201213718256 申请日期 2012.12.18
申请人 GENERAL ELECTRIC COMPANY 发明人 Bunker Ronald Scott;Weaver Scott Andrew;Hasz Wayne Charles
分类号 F02C7/12;B23P17/04 主分类号 F02C7/12
代理机构 代理人
主权项 1. A manufacturing method comprising: providing a substrate with an outer surface and at least one interior space; machining the substrate to selectively remove a portion of the substrate and define one or more cooling supply holes therein, each of the one or more cooling supply holes in fluid communication with the at least one interior space; disposing an open cell porous metallic layer on at least a portion of the substrate, the open cell porous metallic layer in fluid communication with the one or more cooling supply holes; and disposing a coating layer on the open cell porous metallic layer, the coating layer having formed therein one or more cooling exit holes in fluid communication with the open cell porous metallic layer, wherein the substrate, the one or more cooling supply holes, the open cell porous metallic layer and the cooling exit holes provide a cooling network for a component.
地址 Schenectady NY US