发明名称 CURABLE COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a curable resin composition exhibiting improved characteristics for stereolithography and three-dimensional printing applications where a 3D object is formed.SOLUTION: The curable resin composition comprises: (a) a resin composition being liquid at 23°C and comprising either monomers, oligomers or a mixture of monomers and oligomers polymerizable by a ring-opening reaction; (b) an impact modifier containing one or more block copolymers having at least one block composed of methyl methacrylate and (c) one or more polymerization initiators. The curable resin composition can be used for curable coatings per se and specifically for stereolithography and other applications such as three-dimensional printing applications where a 3D object is formed.
申请公布号 JP2014111774(A) 申请公布日期 2014.06.19
申请号 JP20140004783 申请日期 2014.01.15
申请人 THREE D SYST INC 发明人 LOIC MESSE;CAROLE CHAPELAT
分类号 C08L63/00;B29C67/00;C08K5/053;C08K5/101;C08K5/1525;C08L53/00 主分类号 C08L63/00
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