LOW APPLICATION TEMPERATURE HOT MELT ADHESIVE

摘要

The invention relates to a low application temperature hot melt adhesive. More specifically, the low application temperature hot melt adhesive comprises olefin copolymers with an average Melt Index greater than 5 but less than about 35 g/10 minutes at 190° C. The adhesive is particularly useful in the construction of nonwoven articles.

主权项

1. A process for bonding a first substrate to a second substrate with a low application temperature hot melt adhesive comprising the steps of:
(1) applying to at least a portion of the first substrate a low application temperature hot melt adhesive; (2) bringing the second substrate in contact with the adhesive present on the first substrate, and (3) allowing the adhesive to solidify, whereby the first substrate is bonded to the second substrate; wherein the adhesive comprises:
(a) at least about 5 wt % of an olefin copolymer, wherein the olefin copolymer has an average Melt Index range of greater than 5 and less than about 35 g/10 minutes at 190° C.;(b) from about 40 to about 70 wt % of a tackifier;(c) from about 0.5 to about 5 wt % a wax;(d) from about 1 to about 30 wt % of a plasticizer diluent; and(e) from 0 to about 5 wt % of an optional component wherein the sum of the total wt % of the adhesive equals to 100; and wherein the adhesive has a viscosity of below about 11,000 centipoises at 120° C., a yield stress (12 in/min extensional rate) range of from about 7 to about 50 psi at 25° C., a cube flow of less than about 200% at 60° C., and a cross-over temperature (when G″=G′) greater than about 70° C.